At the show, Alpha, a part of the MacDermid Performance Solutions group of business, will be exhibiting its latest range of products for SMT Assembly Solutions, Die Attach Assembly Solutions and Industrial Assembly Solutions. The products include Agromax?, Atrox?, High Temperature Dipping Alloys, Low Melting Point Solder Paste, Assembly Polymers, Innolot Alloys, PowerBond and AccuFlux.
In addition, Alpha will showcase its newly developed solution for void reduction under bottom terminated components (BTC), the ALPHA? AccuFlux? BTC-578 Preform System. The system combines ALPHA? AccuFlux? BTC-578 Preform, solder paste, engineered stencil designs and optimized processing parameters to dramatically and consistently decrease voiding.
For more information on Alpha’s latest product technologies, visit Alpha Assembly Solutions Booth at Internepcon Japan Hall East 5-4.
